The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

May. 24, 2016
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chih-Hsien Chiu, Taichung, TW;

Chia-Yang Chen, Taichung, TW;

Ying-Wei Lu, Taichung, TW;

Jyun-Yuan Jhang, Taichung, TW;

Ming-Fan Tsai, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G06K 19/077 (2006.01); H01L 25/00 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); G06K 19/07777 (2013.01); H01L 25/00 (2013.01); H05K 1/165 (2013.01); H05K 3/0014 (2013.01); H05K 3/465 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/1815 (2013.01); H05K 1/186 (2013.01); H05K 3/107 (2013.01); H05K 3/207 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/1327 (2013.01);
Abstract

An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.


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