The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Apr. 08, 2015
Adeka Corporation, Tokyo, JP;
Tomoharu Yoshino, Tokyo, JP;
Masaki Enzu, Tokyo, JP;
Atsushi Sakurai, Tokyo, JP;
Akihiro Nishida, Tokyo, JP;
Makoto Okabe, Tokyo, JP;
ADEKA CORPORATION, Tokyo, JP;
Abstract
This invention provides a copper compound represented by General Formula (I) below. In General Formula (I), Rto Rindependently represent a linear or branched alkyl group with a carbon number of 1 to 5; provided that Rand Rare a methyl group, Rrepresents a linear or branched alkyl group with a carbon number of 2 to 5; and provided that Ris a methyl group and Ris an ethyl group, Rrepresents a methyl group or a linear or branched alkyl group with a carbon number of 3 to 5. A starting material for forming a thin film of the present invention includes the copper compound represented by General Formula (I). The present invention can provide a copper compound which has a low melting point, can be conveyed in a liquid state, has a high vapor pressure, and is easily vaporizable, and also a starting material for forming a thin film which uses such a copper compound.