The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Sep. 25, 2015
Intel Corporation, Santa Clara, CA (US);
Adel A. Elsherbini, Chandler, AZ (US);
Mathew Manusharow, Phoenix, AZ (US);
Krishna Bharath, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Yidnekachew S. Mekonnen, Chandler, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Henning Braunisch, Phoenix, AZ (US);
Feras Eid, Chandler, AZ (US);
Javier Soto, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.