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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9989854 B1

PDFFull Text
Date of Patent:
Jun. 05, 2018

Filed:

Jul. 22, 2014

Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Masakazu Kume, Tokyo, JP;

Momoko Munakata, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/04 (2006.01); G03F 7/40 (2006.01); G03F 7/11 (2006.01); H01L 21/027 (2006.01); G03F 7/38 (2006.01); H01L 21/033 (2006.01); G03F 7/027 (2006.01); H05K 3/10 (2006.01); G03F 7/033 (2006.01); C23C 18/16 (2006.01); G03F 7/031 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C23C 18/1605 (2013.01); C23C 18/1633 (2013.01); G03F 7/027 (2013.01); G03F 7/031 (2013.01); G03F 7/033 (2013.01); G03F 7/20 (2013.01); G03F 7/32 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/0274 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H05K 3/108 (2013.01);
Abstract

An object of the present invention is to provide a photosensitive resin composition for projection exposure capable of forming a resist pattern that is excellent in adhesion, resolution, and inhibitory properties against the occurrence of resist footing, and the present invention provides a photosensitive resin composition for projection exposure comprising (A) a binder polymer; (B) a photopolymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) a sensitizing dye, wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III):

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