The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Jul. 06, 2012
Applicants:

Shoubin Zhang, Sanda, JP;

Masahiro Shoji, Sanda, JP;

Keita Umemoto, Sanda, JP;

Inventors:

Shoubin Zhang, Sanda, JP;

Masahiro Shoji, Sanda, JP;

Keita Umemoto, Sanda, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/34 (2006.01); C22C 9/00 (2006.01); B22F 9/08 (2006.01); C22C 1/04 (2006.01); B22F 3/14 (2006.01); B22F 9/04 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 9/082 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); B22F 3/14 (2013.01); B22F 2009/043 (2013.01);
Abstract

Provided are a sputtering target which has excellent machinability and is capable of forming a compound film that mainly contains Cu and Ga and a method for producing the sputtering target. The sputtering target of the present invention has a component composition that contains 15 to 40 at % of Ga, 0.1 to 5 at % of Bi, and the balance composed of Cu and unavoidable impurities with respect to all metal elements in the sputtering target. The method for producing the sputtering target includes a step of melting at least Cu, Ga and Bi as simple substances or an alloy that contains two or more of these elements at 1,050° C. or higher to produce an ingot.


Find Patent Forward Citations

Loading…