The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jan. 08, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Jy-Hwang Lin, Hsin-Chu, TW;

Wen-Chieh Wang, Hsinchu, TW;

Tien-Shang Kuo, Taoyuan, TW;

Fu-Hsuan Chu, Keelung, TW;

Hua-Wei Peng, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); H01L 23/562 (2013.01); H01L 27/1462 (2013.01); H01L 27/14623 (2013.01); H01L 27/14678 (2013.01); H01L 27/14643 (2013.01);
Abstract

A semiconductor structure includes a substrate, a plurality of image sensing devices formed in the substrate, at least a passivation layer formed on the substrate, a plurality of first metal patterns formed on the passivation layer, a plurality of gaps formed between the first metal patterns, an insulating layer lining the gaps, and a plurality of light-guiding structures respectively formed in the gaps. The light-guiding structures respectively include an anchor portion and a body portion, and bottom surfaces of the anchor portions being lower than top surfaces of the first metal patterns.


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