The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jul. 31, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;

Inventors:

Tse-Hua Lu, Zhubei, TW;

Ching-Chun Wang, Tainan, TW;

Jhy-Jyi Sze, Hsinchu, TW;

Ping-Fang Hung, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14621 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14685 (2013.01); H01L 27/1464 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01);
Abstract

An image sensor structure and a method for forming the same are provided. The image sensor structure includes a first substrate including a first radiation sensing region and a first interconnect structure formed over a front side of the first substrate. The image sensor structure further includes a second substrate including a second radiation sensing region and a second interconnect structure formed over a front side of the second substrate. In addition, the first interconnect structure is bonded with the second interconnect structure.


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