The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Jul. 12, 2016
Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Yunchu Yu, Shanghai, CN;
Yihua Shen, Shanghai, CN;
Abstract
An interconnect structure is provided. The interconnect structure includes a substrate; and at least a first interconnect component having a first contact region and a second interconnect component having a second contact region. The interconnect structure also includes an interlayer dielectric layer formed on the semiconductor substrate at a same layer as the first interconnect component and the second interconnect component. Further, the interconnect structure includes an interconnect line layer electrically connecting the first contact region and the second contact region formed inside the interlayer dielectric layer.