The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

May. 15, 2017
Applicant:

Silicon Storage Technology, Inc., San Jose, CA (US);

Inventors:

Chien-Sheng Su, Saratoga, CA (US);

Jeng-Wei Yang, Zhubei, TW;

Man-Tang Wu, Xinpu Township, TW;

Chun-Ming Chen, New Taipei, TW;

Hieu Van Tran, San Jose, CA (US);

Nhan Do, Saratoga, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/28 (2006.01); H01L 21/306 (2006.01); G11C 16/04 (2006.01); H01L 29/772 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28 (2013.01); G11C 16/0425 (2013.01); H01L 21/28273 (2013.01); H01L 21/30604 (2013.01); H01L 29/42328 (2013.01); H01L 29/772 (2013.01);
Abstract

A method of forming a memory device that includes forming a first insulation layer on a semiconductor substrate, forming a conductive material layer on the first insulation layer, forming an insulation block on the conductive material layer, forming an insulation spacer along a side surface of the insulation block and on the conductive material layer, etching the conductive material layer to form a block of the conductive material disposed directly under the insulation block and the insulation spacer, removing the insulation spacer, forming a second insulation layer having a first portion wrapping around an exposed upper edge of the block of the conductive material and a second portion disposed on a first portion of the first insulation layer over the substrate, and forming a conductive block insulated from the block of the conductive material by the second insulation layer and from the substrate by the first and second insulation layers.


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