The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Aug. 06, 2014
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Emil Peter Schmitt-Weaver, Veldhoven, NL;

Wolfgang Henke, Veldhoven, NL;

Thomas Leo Maria Hoogenboom, Veldhoven, NL;

Pavel Izikson, Veldhoven, NL;

Paul Frank Luehrmann, Veldhoven, NL;

Daan Maurits Slotboom, Veldhoven, NL;

Jens Staecker, Veldhoven, NL;

Alexander Ypma, Veldhoven, NL;

Assignee:

ASML NETHERLANDS B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/42 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70516 (2013.01); G03F 7/70491 (2013.01); G03F 7/70525 (2013.01); G03F 7/70625 (2013.01); G03F 7/70633 (2013.01);
Abstract

A lithography system configured to apply a pattern to a substrate, the system including a lithography apparatus configured to expose a layer of the substrate according to the pattern, and a machine learning controller configured to control the lithography system to optimize a property of the pattern, the machine learning controller configured to be trained on the basis of a property measured by a metrology unit configured to measure the property of the exposed pattern in the layer and/or a property associated with exposing the pattern onto the substrate, and to correct lithography system drift by adjusting one or more selected from: the lithography apparatus, a track unit configured to apply the layer on the substrate for lithographic exposure, and/or a control unit configured to control an automatic substrate flow among the track unit, the lithography apparatus, and the metrology unit.


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