The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jan. 29, 2015
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Hiroshi Watanabe, Tokyo-to, JP;

Katsuya Hayano, Tokyo-to, JP;

Hideyoshi Takamizawa, Tokyo-to, JP;

Youhei Ohkawa, Tokyo-to, JP;

Takashi Adachi, Tokyo-to, JP;

Ayako Tani, Tokyo-to, JP;

Yoichi Miura, Tokyo-to, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/32 (2012.01); G03F 1/54 (2012.01);
U.S. Cl.
CPC ...
G03F 1/32 (2013.01); G03F 1/54 (2013.01);
Abstract

The present invention provides a mask blank including: a transparent substrate, a half-transparent layer for controlling a phase and a transmittance of the exposure light, formed on the transparent substrate, a middle layer formed on the half-transparent layer, and a light-shielding layer formed on the middle layer, wherein the light-shielding layer is constituted with a single metal material not including a transition metal; a film thickness of the light-shielding layer is 40 nm or less; and an optical density of a laminated body, in which three kinds of layers: the half-transparent layer, the middle layer, and the light-shielding layer are laminated, with respect to the exposure light is a value to the extent that the laminated body functions as a light-shielding region or more; the mask blank is used for producing a half tone type phase shift mask, and suitable for a lithography technique on a wafer from 40 nm half pitch and on for its high light-shielding property even thinning the light-shielding pattern film, capability of decreasing the value of EMF bias, and excellency in pattern processability, light-shielding property and chemical resistance.


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