The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Apr. 29, 2016
Applicant:

Kinsus Interconnect Technology Corp., Taoyuan, TW;

Inventors:

Ting-Hao Lin, Taoyuan, TW;

Chiao-Cheng Chang, Taoyuan, TW;

Yi-Nong Lin, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 1/0298 (2013.01);
Abstract

A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.


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