The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Apr. 04, 2013
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 21/54 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20218 (2013.01); H01L 21/54 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H05K 7/20 (2013.01); H01L 23/3737 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40249 (2013.01); H01L 2224/4103 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
In various embodiments, a package may be provided. The package may include a chip carrier. The package may further include a chip arranged over the chip carrier. The package may also include encapsulation material encapsulating the chip and partially the chip carrier. A coolant receiving recess may be provided over the chip in the encapsulation material, wherein the coolant receiving recess is configured to receive coolant.