The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Dec. 22, 2011
Applicants:

Carlton Ashley Washburn, Rolla, MO (US);

James E. Lamb, Iii, Rolla, MO (US);

Nickolas L. Brakensiek, St. James, MO (US);

Qin Lin, Rolla, MO (US);

Yubao Wang, Rolla, MO (US);

Vandana Krishnamurthy, Rolla, MO (US);

Claudia Scott, Sullivan, MO (US);

Inventors:

Carlton Ashley Washburn, Rolla, MO (US);

James E. Lamb, III, Rolla, MO (US);

Nickolas L. Brakensiek, St. James, MO (US);

Qin Lin, Rolla, MO (US);

Yubao Wang, Rolla, MO (US);

Vandana Krishnamurthy, Rolla, MO (US);

Claudia Scott, Sullivan, MO (US);

Assignee:

Brewer Science, Inc., Rolla, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/26 (2006.01); H01L 21/033 (2006.01); C09D 5/00 (2006.01); G03F 7/11 (2006.01); G03F 7/00 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); C09D 5/00 (2013.01); H01L 21/0338 (2013.01); G03F 7/0035 (2013.01); G03F 7/11 (2013.01); G03F 7/40 (2013.01); Y10T 428/24612 (2015.01);
Abstract

Methods of forming microelectronic structure are provided. The methods comprise the formation of T-shaped structures using a controlled undercutting process, and the deposition of a selectively etchable composition into the undercut areas of the T-shaped structures. The T-shaped structures are subsequently removed to yield extremely small undercut-formed features that conform to the width and optionally the height of the undercut areas of the T-shaped structures. These methods can be combined with other conventional patterning methods to create structures having extremely small feature sizes regardless of the wavelength of light used for patterning.


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