The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Mar. 16, 2012
Applicants:

Osamu Hirakawa, Koshi, JP;

Masaru Honda, Koshi, JP;

Xavier Francois Brun, Chandler, AZ (US);

Charles Wayne Singleton, Jr., Chandler, AZ (US);

Inventors:

Osamu Hirakawa, Koshi, JP;

Masaru Honda, Koshi, JP;

Xavier Francois Brun, Chandler, AZ (US);

Charles Wayne Singleton, Jr., Chandler, AZ (US);

Assignees:

Tokyo Electron Limited, Tokyo, JP;

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H01L 21/6715 (2013.01); H01L 21/67092 (2013.01); H01L 21/67109 (2013.01); H01L 21/67748 (2013.01); B32B 38/10 (2013.01); Y10T 156/1126 (2015.01); Y10T 156/1137 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1189 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1933 (2015.01); Y10T 156/1939 (2015.01); Y10T 156/1972 (2015.01);
Abstract

A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.


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