The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Jun. 26, 2015
Applicants:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
International Business Machines Corporation, New York, NY (US);
Renesas Electronics Corporation, Kawasaki-shi, JP;
Inventors:
Soon Yoeng Tan, Singapore, SG;
Teck Jung Tang, Beacon, NY (US);
Ian D. Melville, Highland, NY (US);
Yelei Vianna Yao, Singapore, SG;
Yasushi Yamagata, Hopewell Junction, NY (US);
Assignees:
INTERNATIONAL BUSINESS MACHINES CORPORATION, New York, NY (US);
GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;
ENESAS ELECTRONICS CORPORATION, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/02 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G06F 17/5068 (2013.01); H01L 22/32 (2013.01); G06F 2217/66 (2013.01);
Abstract
Multi-Project Wafers includes a plurality of chiplets from different IP owners. Non-relevant chiplets are implemented with IP protection to inhibit IP disclosure of non-relevant IP owners.