The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Aug. 03, 2016
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Hemanta Kumar Roy, Bardhaman, IN;
Arpit Jain, Indore, IN;
Arpit Yati, Lucknow, IN;
Olivier Moreau, Sunnyvale, CA (US);
Arun Lobo, Mangalore, IN;
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/22 (2006.01); H01J 37/28 (2006.01); H01J 37/20 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/00 (2013.01); H01J 2237/24571 (2013.01); H01J 2237/24592 (2013.01); H01J 2237/2817 (2013.01);
Abstract
A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).