The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jul. 01, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yasushi Takiguchi, Koshi, JP;

Taro Yamamoto, Koshi, JP;

Hideharu Kyouda, Koshi, JP;

Koshi Muta, Koshi, JP;

Assignee:

Tokyo Electron Limited, Minato-Ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 1/04 (2006.01); B08B 3/04 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); H01L 21/67046 (2013.01); H01L 21/68792 (2013.01);
Abstract

There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.


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