The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jul. 16, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chung-Ming Wang, Chiayi, TW;

Chih-Hsiung Peng, Miaoli County, TW;

Chi-Kang Chang, New Taipei, TW;

Kuei-Shun Chen, New Taipei, TW;

Shih-Chi Fu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5068 (2013.01); H01L 21/823431 (2013.01); H01L 27/0207 (2013.01); H01L 27/0886 (2013.01); H01L 29/0653 (2013.01); G06F 2217/02 (2013.01);
Abstract

A method includes receiving an integrated circuit design layout that includes first and second layout blocks separated by a first space. The first and second layout blocks include, respectively, first and second line patterns oriented lengthwise in a first direction. The method further includes adding a dummy pattern to the first space, which connects the first and second line patterns. The method further includes outputting a mandrel pattern layout and a cut pattern layout in a computer-readable format. The mandrel pattern layout includes the first and second line patterns and the dummy pattern. The cut pattern layout includes a pattern corresponding to the first space. In embodiments, the method further includes manufacturing a first mask with the mandrel pattern layout and manufacturing a second mask with the cut pattern layout. In embodiments, the method further includes patterning a substrate with the first mask and the second mask.


Find Patent Forward Citations

Loading…