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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9941248 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Aug. 17, 2016

Package structures, pop devices and methods of forming the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tien-Chung Yang, Hsinchu, TW;

An-Jhih Su, Taoyuan, TW;

Hsien-Wei Chen, Hsinchu, TW;

Jo-Mei Wang, New Taipei, TW;

Wei-Yu Chen, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Trung Q Dang

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06568 (2013.01);
Abstract

Package structures, PoP devices and methods of forming the same are disclosed. A package structure includes a first chip, a redistribution layer structure, a plurality of UBM pads, a plurality of connectors and a separator. The redistribution layer structure is electrically connected to the first chip. The UBM pads are electrically connected to the redistribution layer structure. The connectors are electrically connected to the UBM pads. The separator is over the redistribution layer structure and surrounds the connectors.

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Quick Actions:

Yang, Tien-Chung. (2018). Package structures, pop devices and methods of forming the same (U.S. Patent No. 9941248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9941248

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