The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jan. 27, 2016
Applicant:

Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Ulrike Schulz, Jena, DE;

Friedrich Rickelt, Jena, DE;

Peter Munzert, Jena, DE;

Hanno Heiβe, Jena, DE;

Heiko Knopf, Jena, DE;

Kevin Füchsel, Jena, DE;

Norbert Kaiser, Jena, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 1/10 (2015.01); G02B 1/118 (2015.01); B29C 59/14 (2006.01); G02B 1/111 (2015.01); G02B 1/14 (2015.01); B05D 1/00 (2006.01); B05D 3/14 (2006.01); C23C 14/28 (2006.01); C23C 14/06 (2006.01); C23C 14/10 (2006.01); C23C 14/12 (2006.01); C23C 14/32 (2006.01);
U.S. Cl.
CPC ...
G02B 1/118 (2013.01); B05D 1/60 (2013.01); B05D 3/145 (2013.01); B29C 59/14 (2013.01); C23C 14/06 (2013.01); C23C 14/10 (2013.01); C23C 14/12 (2013.01); C23C 14/28 (2013.01); C23C 14/32 (2013.01); G02B 1/111 (2013.01); G02B 1/14 (2015.01);
Abstract

A method for producing a reflection-reducing layer system on a substrate and a reflection-reducing layer system are disclosed. According to an embodiment the method includes depositing a refractive index gradient layer on the substrate by co-evaporation of an inorganic material and an organic material, wherein the refractive index gradient layer has a refractive index which decreases in a growth direction, depositing an organic layer above the refractive index gradient layer, and producing a nanostructure in the organic layer by a plasma etching process.


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