The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Apr. 08, 2014
Mitsubishi Materials Corporation, Tokyo, JP;
Kazunari Maki, Saitama, JP;
Hiroyuki Mori, Tsukuba, JP;
Isao Arai, Naka-gun, JP;
Norihisa Iida, Osaka, JP;
Takahiro Takeda, Kawanishi, JP;
Shigeru Shimoizumi, Nishinomiya, JP;
Shin Oikawa, Ageo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 μm or less, and a (Σ3+Σ9) grain boundary length ratio (L (σ3+σ9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, being 28% or greater.