The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Apr. 30, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Junfeng Zhao, Shanghai, CN;

Saeed S. Shojaie, Folsom, CA (US);

Cheng Yang, Shanghai, CN;

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H05K 3/30 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/48 (2013.01); H01L 25/00 (2013.01); H01L 25/0652 (2013.01); H01L 25/16 (2013.01); H01L 25/162 (2013.01); H05K 1/14 (2013.01); H05K 3/303 (2013.01); H05K 3/368 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49131 (2015.01);
Abstract

Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.


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