The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Aug. 09, 2016
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventor:

Chan Syun David Yang, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/263 (2006.01); H01L 21/311 (2006.01); H01L 29/08 (2006.01); H01L 29/40 (2006.01); H01L 29/45 (2006.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01); H01L 21/265 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41791 (2013.01); H01L 21/263 (2013.01); H01L 21/26533 (2013.01); H01L 21/31116 (2013.01); H01L 29/0847 (2013.01); H01L 29/401 (2013.01); H01L 29/45 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01); H01L 29/7851 (2013.01); H01L 21/26506 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/165 (2013.01); H01L 2029/7858 (2013.01);
Abstract

Some embodiments of the present disclosure relate to a contact formed to a source or drain region of a 'finned' field-effect transistor (FinFET). An epitaxial material is formed over the source or drain region, which includes a diamond-shaped cross-section with top and bottom surfaces. A capping layer is formed over the top and bottom surfaces. The source or drain region is subjected to a first etch to remove the capping layer surrounding the top surfaces of the diamond-shaped cross-section. A protective layer is formed within the top surfaces. A second etch of the capping layer is performed to remove the capping layer surrounding the bottom surfaces of the diamond-shaped cross-section, while using the protective layer to prevent etching of the top surfaces by the second etch. A contact is formed to the source or drain region, which surrounds the source or drain region on the top and bottom surfaces.


Find Patent Forward Citations

Yang, Chan Syun David. (2018). Methods for forming wrap around contact (U.S. Patent No. 9935172). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9935172

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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