The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Oct. 26, 2016
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Sheng-Chen Wang, Hsinchu, TW;

Sai-Hooi Yeong, Hsinchu County, TW;

Tsung-Yao Wen, Hsinchu, TW;

Yen-Ming Chen, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/283 (2006.01); H01L 21/3065 (2006.01); H01L 29/06 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); H01L 21/0217 (2013.01); H01L 21/283 (2013.01); H01L 21/3065 (2013.01); H01L 21/76224 (2013.01); H01L 29/0649 (2013.01); H01L 29/0657 (2013.01); H01L 29/66795 (2013.01); H01L 29/66818 (2013.01); H01L 29/785 (2013.01); H01L 21/0214 (2013.01); H01L 21/0228 (2013.01); H01L 21/02167 (2013.01); H01L 21/31111 (2013.01);
Abstract

Structures and methods are provided for forming fin structures. A first fin structure is formed on a substrate. A shallow-trench-isolation structure is formed surrounding the first fin structure. At least part of the first fin structure is removed to form a cavity. A first material is formed on one or more side walls of the cavity. A second material is formed to fill the cavity, the second material being different from the first material. At least part of the STI structure is removed to form a second fin structure including the first material and the second material. At least part of the first material that surrounds the second material is removed to fabricate semiconductor devices.


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