The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Jun. 05, 2015
Applicant:

Air Products and Chemicals, Inc., Allentown, PA (US);

Inventors:

Raymond Nicholas Vrtis, Orefield, PA (US);

Robert Gordon Ridgeway, Quakertown, PA (US);

Jianheng Li, Emmaus, PA (US);

William Robert Entley, Center Valley, PA (US);

Jennifer Lynn Anne Achtyl, Bethlehem, PA (US);

Xinjian Lei, Vista, CA (US);

Assignee:

VERSUM MATERIALS US, LLC, Tempe, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); H01B 3/18 (2006.01); C23C 16/30 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); C23C 16/30 (2013.01); C23C 16/56 (2013.01); H01B 3/18 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01); H01L 21/02216 (2013.01); H01L 21/02348 (2013.01);
Abstract

A method and composition for producing a porous low k dielectric film via chemical vapor deposition is provided. In one aspect, the method comprises the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber gaseous reagents including at least one structure-forming precursor comprising an alkyl-alkoxysilacyclic compound, and a porogen; applying energy to the gaseous reagents in the reaction chamber to induce reaction of the gaseous reagents to deposit a preliminary film on the substrate, wherein the preliminary film contains the porogen, and the preliminary film is deposited; and removing from the preliminary film at least a portion of the porogen contained therein and provide the film with pores and a dielectric constant of 2.7 or less. In certain embodiments, the structure-forming precursor further comprises a hardening additive.


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