The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

May. 05, 2016
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Sean Moran, Burlingame, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 23/04 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/04 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/3675 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01);
Abstract

A dielectric element has a plurality of contacts at a first surface and a plurality of first traces coupled thereto which extend in directions parallel to the first surface. A circuit structure made of a plurality of dielectric layers and electrically conductive features thereon includes a plurality of bumps at a first surface which face the contacts of the dielectric element and are joined thereto. Circuit structure contacts at a second surface opposite the first surface are electrically coupled with the bumps through second traces on the circuit structure, the circuit structure contacts configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements, wherein the microelectronic elements can be assembled therewith such that element contacts thereof face and are joined with the circuit structure contacts.


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