The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Feb. 16, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Daniel C. Edelstein, White Plains, NY (US);

Nicholas C. Fuller, North Hills, NY (US);

Elbert E. Huang, Carmel, NY (US);

Satyanarayana V. Nitta, Cross River, NY (US);

David L. Rath, Stormville, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/0217 (2013.01); H01L 21/0332 (2013.01); H01L 21/76805 (2013.01); H01L 21/76811 (2013.01); H01L 21/76813 (2013.01); H01L 21/76829 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76883 (2013.01); H01L 21/76897 (2013.01); H01L 23/528 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A structure having fully aligned via connecting metal lines on different Mx levels. The structure may include a first metal line and a second metal line in a first ILD, a cap covering the first ILD, the second metal line and a portion of the first metal line, a second ILD on the cap, and a via that electrically connects the first metal line to a third metal line, wherein the third metal line is above the first metal line and runs perpendicular to the first metal line, the via is fully aligned to the first metal line and the third metal line, and the via electrically connects the first metal line to the third metal line.


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