The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Feb. 14, 2016
Amkor Technology, Inc., Tempe, AZ (US);
Kyoung Yeon Lee, Gyeonggi-do, KR;
Byong Jin Kim, Gyeonggi-do, KR;
Jae Min Bae, Seoul, KR;
Hyung Il Jeon, Gyeonggi-do, KR;
Gi Jeong Kim, Gyeonggi-do, KR;
Ji Young Chung, Gyeonggi-do, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.