logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9905509 B1

PDFFull Text
Date of Patent:
Feb. 27, 2018

Filed:

Jul. 25, 2014

Inverted-t shaped via for reducing adverse stress-migration effects

Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Yen-Lu Chen, Hsinchu, TW;

Shih-Ping Hong, Hsinchu, TW;

Ta Hung Yang, Hsinchu, TW;

Assignee:

MACRONIX INTERNATIONAL CO., LTD., Hsinchu, TW;

Attorneys:

Stout, Uxa & Buyan, LLP

Frank J. Uxa

Primary Examiner:

Stephen W Smoot

Assistant Examiner:

Sun M King

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/31116 (2013.01); H01L 21/76804 (2013.01); H01L 21/76816 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor interconnect structure is formed as a via with an inverted-T shape to increase the reliability of the interface between the interconnect structure and an underlying electrically conductive, e.g., copper (Cu), layer of material. The inverted-T shape effectively increases a bottom critical dimension of the via, thereby reducing and/or eliminating via degradation of the interconnect structure caused by voids in the electrically conductive layer introduced during high-temperature or stress-migration baking.

Find Patent Forward Citations

Chen, Yen-Lu. (2018). Inverted-t shaped via for reducing adverse stress-migration effects (U.S. Patent No. 9905509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9905509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…