The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Sep. 09, 2015
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Dai Fukushima, Kuwana, JP;

Jun Takayasu, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01);
Abstract

A polishing apparatus includes a polisher, a holder, and a supplier. The polisher polishes a semiconductor substrate or a polishing target film on a semiconductor substrate. The holder holds the semiconductor substrate and presses the semiconductor substrate or the polishing target film against the polisher to rub the semiconductor substrate or the polishing target film against the polisher. The supplier has a nozzle that is to be inserted to the inside of the polisher and that supplies a polishing solution to the inside of the polisher.


Find Patent Forward Citations

Fukushima, Dai. (2018). Polishing apparatus, polishing method, and semiconductor manufacturing method (U.S. Patent No. 9902038). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9902038

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…