The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Apr. 03, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Zhichao Zhang, Chandler, AZ (US);
Gong Ouyang, Olympia, WA (US);
Kai Xiao, University Place, WA (US);
Kemal Aygun, Chandler, AZ (US);
Beom-Taek Lee, Mountain View, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 41/04 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H01F 17/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H01F 17/0013 (2013.01); H05K 1/0233 (2013.01); H01F 2017/002 (2013.01); H05K 1/116 (2013.01); H05K 1/165 (2013.01);
Abstract
Systems, apparatuses, and methods may include a circuit board having a plated through hole with a via portion and a stub portion and a self-coupled inductor electrically coupled to the via portion of the plated through hole. The self-coupled inductor may include a first inductor mutually coupled to a second inductor in series to reduce a capacitive effect of the stub portion of the plated through hole.