The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jan. 09, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Natalie B. Feilchenfeld, Jericho, VT (US);

Michael J. Zierak, Essex Junction, VT (US);

Max G. Levy, Essex Junction, VT (US);

BethAnn Lawrence, Essex Junction, VT (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/40 (2006.01); H01L 21/762 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 29/10 (2006.01); H01L 23/532 (2006.01); H01L 27/12 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 21/76283 (2013.01); H01L 21/76802 (2013.01); H01L 23/5226 (2013.01); H01L 23/53271 (2013.01); H01L 27/1207 (2013.01); H01L 29/107 (2013.01); H01L 29/1087 (2013.01); H01L 29/7824 (2013.01);
Abstract

Structures that include contact trenches and isolation trenches, as well as methods for forming structures including contact trenches and isolation trenches. A contact trench is formed that extends through a device layer of a silicon-on-insulator (SOI) substrate to a buried oxide layer of the SOI substrate. An isolation trench is formed that extends through the device layer to the buried oxide layer. An electrical insulator is deposited that fills the contact trench and the first isolation trench. The electrical insulator is removed from the contact trench. After the electrical insulator is removed from the contact trench, an electrical conductor is formed in the contact trench. The electrical contact may be coupled with a doped region in a handle wafer of the SOI substrate.


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