The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jan. 03, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Kuo-Shu Tseng, New Taipei, TW;

Chien-Hua Chen, Taichung, TW;

You-Feng Chen, Taichung, TW;

Yen-Yu Chen, Taichung, TW;

Zhong-Yi Chen, Tainan, TW;

Yung-Haw Liaw, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01L 21/0276 (2013.01); H01L 21/67017 (2013.01); H01L 21/67253 (2013.01);
Abstract

Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.


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