The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jun. 02, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

Anthony K. Stamper, Burlington, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 49/02 (2006.01); H01L 23/48 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 23/498 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/3065 (2013.01); H01L 21/311 (2013.01); H01L 21/31051 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 28/90 (2013.01);
Abstract

One aspect of the disclosure relates to a method of forming an integrated circuit structure. The method may include: providing a substrate having a front side and a back side, the substrate including: a deep trench (DT) capacitor within the substrate extending toward the back side of substrate, and a through silicon via (TSV) adjacent to the DT capacitor within the substrate extending toward the back side of the substrate, the TSV including a metal substantially surrounded by a liner layer and an insulating layer substantially surrounding the liner layer; etching the back side of the substrate to expose the TSV on the back side of the substrate; and forming a first dielectric layer covering the exposed TSV on the back side of the substrate and extending away from the front side of the substrate.


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