The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Nov. 07, 2012
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takehiro Tanikawa, Miyagi, JP;

Kazuki Moyama, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 9/00 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); C23C 16/4401 (2013.01); H01J 37/32192 (2013.01); H01J 37/32642 (2013.01); H01J 37/32715 (2013.01); H01J 37/32862 (2013.01); H01L 21/32137 (2013.01); Y10T 29/49998 (2015.01);
Abstract

A method of controlling adherence of microparticles to a substrate to be processed includes applying voltage to an electrostatic chuck configured to electrostatically attract the substrate to be processed in a processing container before the substrate to be processed is carried into the processing container; and, after the applying of voltage to the electrostatic chuck, carrying the substrate to be processed into the processing container. Further, in the applying of voltage to the electrostatic chuck, the voltage is applied to the electrostatic chuck to reduce a potential difference between a focus ring and the substrate to be processed, the focus ring being provided to surround the electrostatic chuck.


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