The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jan. 21, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Seiki Ishida, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/10 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B08B 3/10 (2013.01); H01L 21/02041 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01); H01L 21/68742 (2013.01);
Abstract

A first holding plate and a second holding plate are provided. The first holding plate has a first flat plate portion facing a bottom surface of a substrate and holds the substrate so as to form a gap between the first flat plate portion and the substrate as a first gap, and the second holding plate has a second flat plate portion facing the bottom surface of the substrate and holds the substrate so as to form a gap between the second flat plate portion and the substrate as a second gap. Depending on a processing to be performed, any one of the first holding plate and the second holding plate is mounted on a rotational shaft of a shaft mechanism that includes a fluid supply unit configured to supply a fluid to the bottom surface of the substrate and the rotational shaft configured to rotate the substrate. The processing is performed on the substrate by supplying the fluid to the bottom surface of the substrate from the fluid supply unit.


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