The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Jul. 03, 2014
Intel Corporation, Santa Clara, CA (US);
Manish Dubey, Chandler, AZ (US);
Rajendra C. Dias, Phoenix, AZ (US);
Patrick Nardi, Scottsdale, AZ (US);
David Woodhams, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Some embodiments relate to an electronic package. The electronic package includes a substrate and a die attached to the substrate. The electronic package further includes an underfill positioned between the die and the substrate due to capillary action. A support surrounds the die. The support provides the same beneficial fillet geometry on all die edges. Therefore, the support provides similar stress reduction on all die edges. Other embodiments relate to method of fabricating an electronic package. The method includes attaching a die to a substrate and inserting an underfill between the die and the substrate using capillary action. The method further includes placing a support around the die such that the support surrounds the die.