The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Nov. 16, 2016
Unimicron Technology Corp., Taoyuan, TW;
Hsiang-Hung Huang, New Taipei, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A package structure includes a circuit substrate, first and second build-up circuit structures, and a plurality of piezoelectric heat dissipation units. The circuit substrate includes a core layer, a plurality of electronic devices, and a conducting unit. The electronic devices are embedded in the core layer, and active surfaces of the two adjacent electronic devices respectively face a first surface and a second surface of the core layer. The conducting unit is disposed on the core layer and electrically connected to the electronic devices. The first and second build-up circuit structures are respectively disposed on the first and the second surfaces and respectively have at least one first and at least one second openings. The piezoelectric heat dissipation units respectively correspond to the active surfaces of the electronic devices and are electrically connected to the conducting unit exposed by the first and the second openings.