The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Dec. 19, 2013
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Wanbing Yi, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Wei Shao, Singapore, SG;

Gong Shun Qiang, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01);
Abstract

An integrated circuit includes a copper hillock-detecting structure. The copper hillock-detecting structure includes a copper metallization layer and an intermediate plate structure spaced apart from adjacent to the copper metallization layer. The intermediate plate structure includes a conducting material plate. The intermediate plate structure further includes a plurality of conductive vias that are electrically and physically connected with the conducting material plate. The copper hillock-detecting structure further includes a sensing plate adjacent to the intermediate plate and electrically and physically connected with the plurality of vias such that the vias are disposed between the intermediate plate and the sensing plate.


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