The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Jul. 26, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Anand Murthy, Portland, OR (US);

Boyan Boyanov, Portland, OR (US);

Glenn A. Glass, Beaverton, OR (US);

Thomas Hoffmann, Portland, OR (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 29/78 (2006.01); H01L 21/285 (2006.01); H01L 21/8238 (2006.01); H01L 29/165 (2006.01); H01L 29/66 (2006.01); H01L 29/167 (2006.01); H01L 29/36 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/28518 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/167 (2013.01); H01L 29/36 (2013.01); H01L 29/41725 (2013.01); H01L 29/665 (2013.01); H01L 29/6628 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/6659 (2013.01); H01L 29/66628 (2013.01); H01L 29/66636 (2013.01); H01L 29/78 (2013.01); H01L 29/7833 (2013.01); H01L 29/7842 (2013.01); Y10S 438/933 (2013.01);
Abstract

An embodiment of the invention reduces the external resistance of a transistor by utilizing a silicon germanium alloy for the source and drain regions and a nickel silicon germanium self-aligned silicide (i.e., salicide) layer to form the contact surface of the source and drain regions. The interface of the silicon germanium and the nickel silicon germanium silicide has a lower specific contact resistivity based on a decreased metal-semiconductor work function between the silicon germanium and the silicide and the increased carrier mobility in silicon germanium versus silicon. The silicon germanium may be doped to further tune its electrical properties. A reduction of the external resistance of a transistor equates to increased transistor performance both in switching speed and power consumption.


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