The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Dec. 31, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Takashi Ando, Tuckahoe, NY (US);

Veeraraghavan S. Basker, Schenectady, NY (US);

Johnathan E. Faltermeier, San Jose, CA (US);

Hemanth Jagannathan, Niksayuna, NY (US);

Tenko Yamashita, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 29/76 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 29/401 (2013.01); H01L 29/42364 (2013.01); H01L 29/6653 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A semiconductor structure includes a semiconductor substrate having an outer surface; a plurality of oxide regions, located outward of the outer surface, and defining a plurality of metal-gate-stack-receiving cavities; and a liner interspersed between the plurality of oxide regions and the semiconductor substrate and between the plurality of oxide regions and the plurality of metal-gate-stack-receiving cavities. A layer of high-K material is deposited over the semiconductor structure, including on outer surfaces of the plurality of oxide regions, outer edges of the liner, on walls of the plurality of metal-gate-stack-receiving cavities, and on the outer surface of the semiconductor substrate within the plurality of metal-gate-stack-receiving cavities. The layer of high-K material is chamfered to remove same from the outer surfaces of the plurality of oxide regions, the outer edges of the liner, and partially down the walls of the plurality of metal-gate-stack-receiving cavities.


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