The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Sep. 28, 2015
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Nishant Sinha, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 27/06 (2006.01); H01L 27/11556 (2017.01); H01L 29/788 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11556 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 27/0688 (2013.01); H01L 29/7889 (2013.01); H01L 29/78642 (2013.01);
Abstract
Methods of fabricating multi-tiered semiconductor devices are described, along with apparatus and systems that include them. In one such method, a first dielectric is formed, and a second dielectric is formed in contact with the first dielectric. A channel is formed through the first dielectric and the second dielectric with a first etch chemistry, a void is formed in the first dielectric with a second etch chemistry, and a device is formed at least partially in the void in the first dielectric. Additional embodiments are also described.