The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Apr. 03, 2014
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Thirupurasundari Jayaraman, Chennai, IN;

Raghav Babulnath, San Jose, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/265 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01N 21/9501 (2013.01); G06T 7/001 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for dynamic design attributes for wafer inspection are provided. One method includes, at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning (DBB) process. The information includes one or more formulae for calculating design attributes from a design for a wafer. The design attributes are used to bin the defects in the DBB process. The method also includes performing inspection of a wafer according to an updated wafer inspection recipe. Performing the inspection includes binning defects detected on the wafer according to the DBB process in the updated wafer inspection recipe.


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