The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Nov. 14, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Meliha Gozde Rainville, Beaverton, OR (US);

Nagraj Shankar, Tualatin, OR (US);

Kapu Sirish Reddy, Portland, OR (US);

Dennis M. Hausmann, Lake Oswego, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); C23C 22/05 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); C23C 22/05 (2013.01); H01L 21/02178 (2013.01); H01L 21/02205 (2013.01); H01L 21/31144 (2013.01); H01L 23/53209 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01);
Abstract

Aluminum oxide films characterized by a dielectric constant (k) of less than about 7 (such as between about 4-6) and having a density of at least about 2.5 g/cm(such as about 3.0-3.2 g/cm) are deposited on partially fabricated semiconductor devices over both metal and dielectric to serve as etch stop layers. The films are deposited using a deposition method that does not lead to oxidative damage of the metal. The deposition involves reacting an aluminum-containing precursor (e.g., a trialkylaluminum) with an alcohol and/or aluminum alkoxide. In one implementation the method involves flowing trimethylaluminum to the process chamber housing a substrate having an exposed metal and dielectric layers; purging and/or evacuating the process chamber; flowing t-butanol to the process chamber and allowing it to react with trimethylaluminum to form an aluminum oxide film and repeating the process steps until the film of desired thickness is formed.


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