The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Dec. 22, 2015
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Scott C. Holden, Melrose, MA (US);

Bon-Woong Koo, Andover, MA (US);

Brant S. Binns, Beverly, MA (US);

Richard M. White, Newmarket, NH (US);

Kenneth L. Starks, Gloucester, MA (US);

Eric R. Cobb, Danvers, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 27/02 (2006.01); H01J 37/30 (2006.01); H01J 37/08 (2006.01); H01J 37/317 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3002 (2013.01); H01J 37/08 (2013.01); H01J 37/3171 (2013.01); H01J 2237/002 (2013.01);
Abstract

An ion source with improved temperature control is disclosed. A portion of the ion source is nestled within a recessed cavity in a heat sink, where the portion of the ion source and the recessed cavity are each shaped so that expansion of the ion source causes high pressure thermal contact with the heat sink. For example, the ion source may have a tapered cylindrical end, which fits within a recessed cavity in the heat sink. Thermal expansion of the ion source causes the tapered cylindrical end to press against the recessed cavity in the heat sink. By proper selection of the temperature of the heat sink, the temperature and flow of coolant fluid through the heat sink, and the size of the gap between the heat sink and the ion source, the temperature of the ion source can be controlled.


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