The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Nov. 27, 2015
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Yasushi Inagaki, Ogaki, JP;

Toshiki Furutani, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H05K 3/4661 (2013.01); H05K 3/4682 (2013.01); H05K 3/4688 (2013.01); H01L 23/145 (2013.01); H01L 23/5386 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0243 (2013.01); H05K 3/108 (2013.01);
Abstract

A printed wiring board includes a first insulating layer, a first conductor layer formed on first surface of the first insulating layer, a second conductor layer formed on second surface of the first insulating layer, a first via structure formed in the first insulating layer such that the first via structure is connecting the first and second conductor layers, a second insulating layer formed on the second surface of the first insulating layer such that the second conductor layer is embedded into the second insulating layer, a third conductor layer formed on the second insulating layer, and a second via structure formed in the second insulating layer such that the second via structure is connecting the second and third conductor layers. The second conductor layer includes a dedicated wiring layer which transmits data between two electronic components to be mounted to the first surface of the first insulating layer.


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