The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Feb. 22, 2016
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Sylvain Maitrejean, Grenoble, FR;

Emmanuel Augendre, Montbonnot, FR;

Jean-Charles Barbe, Izeron, FR;

Benoit Mathieu, Grenoble, FR;

Yves Morand, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/469 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6681 (2013.01); H01L 21/02532 (2013.01); H01L 21/3065 (2013.01); H01L 21/31144 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/6653 (2013.01); H01L 29/66553 (2013.01); H01L 29/66795 (2013.01); H01L 29/7843 (2013.01); H01L 29/7847 (2013.01); H01L 29/78696 (2013.01);
Abstract

A method of modifying a strain state of a first channel structure in a transistor is provided, said structure being formed from superposed semiconducting elements, the method including providing on a substrate at least one first semiconducting structure formed from a semiconducting stack including alternating elements based on at least one first semiconducting material and elements based on at least one second semiconducting material different from the first material; then removing portions of the second material from the first semiconducting structure by selective etching, the removed portions forming at least one empty space; filling the empty space with a dielectric material; forming a straining zone on the first semiconducting structure based on a first strained material having an intrinsic strain; and performing thermal annealing to cause the dielectric material to creep, and to cause a change in a strain state of the elements based on the first material.


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