The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Dec. 14, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Dechao Guo, Fishkill, NY (US);

Wilfried E. Haensch, Somers, NY (US);

Shu-jen Han, Cortlandt Manor, NY (US);

Daniel J. Jaeger, Wappingers Falls, NY (US);

Yu Lu, Hopewell Junction, NY (US);

Keith Kwong Hon Wong, Wappingers Falls, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/45 (2006.01); H01L 21/28 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4925 (2013.01); H01L 29/42372 (2013.01); H01L 29/456 (2013.01); H01L 29/665 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/66477 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01); H01L 21/28052 (2013.01); H01L 29/66628 (2013.01); H01L 29/66636 (2013.01); H01L 29/7848 (2013.01);
Abstract

A gate structure in a semiconductor device includes: a gate stack formed on a substrate with three sections, a bottom portion, a top portion, and a sacrificial cap layer over the top portion; gate spacers, source and drain regions, a nitride encapsulation over top and sidewalls of the gate stack after removal of the sacrificial cap layer, an organic planarizing layer over the nitride encapsulation, planarizing the encapsulation, and silicidation performed over the source and drain regions and the bottom portion after removal of the nitride encapsulation, the organic planarizing layer, and the top portion of the gate stack.


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