The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Jan. 03, 2017
Kabushiki Kaisha Toshiba, Tokyo, JP;
Yasuhiko Akaike, Kanazawa Ishikawa, JP;
Kenya Kobayashi, Nonoichi Ishikawa, JP;
Yukie Nishikawa, Nonoichi Ishikawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor package in an embodiment includes a semiconductor device which has a first semiconductor element, a second semiconductor element, and a common first electrode between the first and second semiconductor elements. A second electrode is electrically connected to the first semiconductor element. A third electrode extends through the second semiconductor element and electrically connects to the first electrode. A fourth electrode is electrically connected to the second semiconductor element. A first terminal of the package is electrically connected to the third electrode. A second terminal of the package is electrically connected to the second electrode and the fourth electrode. An insulating material surrounds the semiconductor device.